Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6005030 | Epoxy resin composition for semiconductor sealing and resin molded type semiconductor device sealed with the epoxy resin composition | Mitsuo TOGAWA, Takahiro Horie, Naoki Nara | 1999-12-21 |
| 5567990 | Resin-encapsulated semiconductor device | Tatsuo Kawata, Hiroshi Suzuki, Hiroki Sashima, Osamu Horie | 1996-10-22 |