Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6005030 | Epoxy resin composition for semiconductor sealing and resin molded type semiconductor device sealed with the epoxy resin composition | Kazuhiko Miyabayashi, Takahiro Horie, Naoki Nara | 1999-12-21 |