Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7740936 | Adhesion assisting agent fitted metal foil, and printed wiring board using thereof | Nobuyuki Ogawa, Hitoshi Onozeki, Takahiro Tanabe, Kenji Takai, Norio Moriike +2 more | 2010-06-22 |
| 7572503 | Method for preparing an insulating resin composition, insulating resin composition, multilayer wiring board and process for producing the same | Shin Takanezawa, Koji Morita, Takako Watanabe, Hiroyuki Fukai, Hiroaki Fujita | 2009-08-11 |
| 6979712 | Method for preparing an insulating resin composition, insulating resin composition, multilayer wiring board and process for producing the same | Shin Takanezawa, Koji Morita, Takako Watanabe, Hiroyuki Fukai, Hiroaki Fujita | 2005-12-27 |
| 6841605 | Adhesive composition for metal foil, and adhesive-coated metal foil, metal-clad laminate and related materials using the same | Takeshi Horiuchi, Kazuyuki Magome, Norifumi Shiraishi | 2005-01-11 |
| 5066691 | Adhesive composition for metal-clad laminates | Ken Nanaumi, Ryoichi Ikezawa, Hideki Eriguchi | 1991-11-19 |