Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6492203 | Semiconductor device and method of fabrication thereof | Yoshiaki Wakashima, Naoki Fukutomi, Kazuhisa Suzuki, Toshio Yamazaki, Tsutomu Kitakatsu +1 more | 2002-12-10 |
| 6268648 | Board for mounting semiconductor element, method for manufacturing the same, and semiconductor device | Naoki Fukutomi, Yoshiaki Wakashima, Susumu Naoyuki | 2001-07-31 |
| 5885723 | Bonding film for printed circuit boards | Atsushi Takahashi, Shinji Ogi, Koji Morita, Kazunori Yamamoto, Ken Nanaumi +4 more | 1999-03-23 |
| 5689879 | Metal foil for printed wiring board and production thereof | Naoyuki Urasaki, Kouichi Tsuyama, Kiyoshi Hasegawa, Shuichi Hatakeyama, Akishi Nakaso +1 more | 1997-11-25 |
| 5690837 | Process for producing multilayer printed circuit board | Akishi Nakaso, Koichi Tsuyama, Kazuhisa Otsuka, Haruo Ogino, Yoshihiro Tamura +5 more | 1997-11-25 |
| 5638598 | Process for producing a printed wiring board | Akishi Nakaso, Kouichi Tsuyama, Shuichi Hatakeyama, Naoyuki Urasaki | 1997-06-17 |
| 5444189 | Printed wiring board and production thereof | Akishi Nakaso, Kouichi Tsuyama, Shuichi Hatakeyama, Naoyuki Urasaki | 1995-08-22 |
| 5403672 | Metal foil for printed wiring board and production thereof | Naoyuki Urasaki, Kouichi Tsuyama, Kiyoshi Hasegawa, Shuichi Hatakeyama, Akishi Nakaso +1 more | 1995-04-04 |
| 4830691 | Process for producing high-density wiring board | Naoki Fukutomi, Yoshiaki Tsubomatsu, Takuya Yasuoka | 1989-05-16 |