Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10027012 | Multilayer wiring plate and method for fabricating same | Hiroyuki Yamaguchi, Hajime Nakayama, Seiichi Kurihara | 2018-07-17 |
| 9966164 | Insulated coated wire having a wire coating layer of a resin surrounded by a wire adhesive layer of a resin | Hiroyuki Yamaguchi, Seiichi Kurihara | 2018-05-08 |
| 5690837 | Process for producing multilayer printed circuit board | Akishi Nakaso, Koichi Tsuyama, Kazuhisa Otsuka, Yoshihiro Tamura, Teiichi Inada +5 more | 1997-11-25 |
| 5243144 | Wiring board and process for producing the same | Hiroharu Kamiyama, Akishi Nakaso | 1993-09-07 |
| 4902551 | Process for treating copper surface | Akishi Nakaso, Toshiro Okamura, Tomoko Watanabe, Yuko Kimura | 1990-02-20 |