Issued Patents All Time
Showing 1–22 of 22 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6811828 | Electroless gold plating solution and method for electroless plating | Akio Takahashi, Hiroshi Yamamoto, Sumiko Nakajima, Kiyoshi Hasegawa | 2004-11-02 |
| 5584121 | Process for producing multiple wire wiring board | Shigeharu Arike, Yorio Iwasaki, Eiichi Shinada, Toshiro Okamura, Yuichi Nakazato | 1996-12-17 |
| 5486655 | Multiple wire adhesive on a multiple wire wiring board | Shigeharu Arike, Yorio Iwasaki, Eiichi Shinada, Toshiro Okamura, Yuichi Nakazato | 1996-01-23 |
| 5403869 | Adhesive of epoxy resins, epoxy-modified polybutadiene and photoinitiator | Shigeharu Arike, Yorio Iwasaki, Eiichi Shinada, Toshiro Okamura, Yuichi Nakazato | 1995-04-04 |
| 5336132 | Multisensation creation apparatus employing stereoscopic imagery | — | 1994-08-09 |
| 5139923 | Method for improving adhesion of a resist layer to a metallic layer and electrolessly plating a wiring pattern thereon | Ritsuji Toba, Mineo Kawamoto | 1992-08-18 |
| 5028513 | Process for producing printed circuit board | Mineo Kawamoto, Akio Tadokoro, Haruo Akahoshi, Toshikazu Narahara, Ritsuji Toba +3 more | 1991-07-02 |
| 4970107 | Composite article comprising a copper element and a process for producing it | Haruo Akahoshi, Yoshihiro Suzuki, Akira Nagai, Kiyonori Kogawa, Akio Takahashi | 1990-11-13 |
| 4919197 | Atmosphere control apparatus for theaters | — | 1990-04-24 |
| 4881122 | Three-dimensional shooting video camera apparatus | — | 1989-11-14 |
| 4876177 | Process for producing printed circuit board | Haruo Akahoshi, Mineo Kawamoto, Akio Tadokoro, Toyofusa Yoshimura | 1989-10-24 |
| 4865888 | Process for electroless copper plating and apparatus used therefor | Haruo Akahoshi, Mineo Kawamoto, Akio Takokoro, Ritsuji Toba, Toyofusa Yoshimura | 1989-09-12 |
| 4838344 | Atmosphere control apparatus for theaters | — | 1989-06-13 |
| 4820549 | Photo-curable resist resin composition for electroless plating, process for preparing a printed circuit board with the said resist resin composition and a printed circuit board having resist prepared from the said resist resin composition | Kiyoshi Ozaki, Atsushi Mori, Hideo Tsuda, Mineo Kawamoto, Motoyo Wajima | 1989-04-11 |
| 4642161 | Method of bonding copper and resin | Haruo Akahoshi, Motoyo Wajima, Kiyonori Kogawa, Ritsuji Toba, Takeshi Shimazaki | 1987-02-10 |
| 4632852 | Process for electroless copper plating | Haruo Akahoshi, Mineo Kawamoto, Motoyo Wajima, Rituji Toba, Shoji Kawakubo +1 more | 1986-12-30 |
| 4610910 | Printed circuit board, process for preparing the same and resist ink used therefor | Mineo Kawamoto, Haruo Akahoshi, Yoichi Matsuda, Motoyo Wajima, Makoto Matsunaga +4 more | 1986-09-09 |
| 4604160 | Method for manufacture of printed wiring board | Haruo Akahoshi, Mineo Kawamoto, Motoyo Wajima, Yoichi Matsuda, Kyoji Kawakubo +3 more | 1986-08-05 |
| 4457952 | Process for producing printed circuit boards | Mineo Kawamoto, Yutaka Itoh, Youichi Matsuda, Motoyo Wajima, Hirosada Morishita +2 more | 1984-07-03 |
| 4378384 | Process for producing printed circuit board by electroless plating | Mineo Kawamoto, Yutaka Itoh, Youichi Matsuda, Motoyo Wajima, Shoji Kawakubo +1 more | 1983-03-29 |
| 4343659 | Process for producing copper barrier type, nuclear fuel cladding | Motoyo Wajima, Tetsuo Ishikawa | 1982-08-10 |
| 4239813 | Process for forming printed wiring by electroless deposition | Mineo Kawamoto, Yoichi Matsuda, Motoyo Wajima, Hirosada Morishita | 1980-12-16 |