Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5139923 | Method for improving adhesion of a resist layer to a metallic layer and electrolessly plating a wiring pattern thereon | Kanji Murakami, Mineo Kawamoto | 1992-08-18 |
| 5045353 | Method for treating interior surfaces of holes and apparatus therefor | Yuuzi Takada, Satoshi Yoshitomi, Nobuaki Ooki | 1991-09-03 |
| 5028513 | Process for producing printed circuit board | Kanji Murakami, Mineo Kawamoto, Akio Tadokoro, Haruo Akahoshi, Toshikazu Narahara +3 more | 1991-07-02 |
| 4865888 | Process for electroless copper plating and apparatus used therefor | Haruo Akahoshi, Kanji Murakami, Mineo Kawamoto, Akio Takokoro, Toyofusa Yoshimura | 1989-09-12 |
| 4781943 | Process for pretreatment before plating through-holes of printed circuit boards | Tsunehumi Mutoo | 1988-11-01 |
| 4642161 | Method of bonding copper and resin | Haruo Akahoshi, Kanji Murakami, Motoyo Wajima, Kiyonori Kogawa, Takeshi Shimazaki | 1987-02-10 |