Issued Patents All Time
Showing 1–25 of 34 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5768108 | Multi-layer wiring structure | Osamu Miura, Kunio Miyazaki, Akio Takahashi, Ryuji Watanabe, Takao Miwa +2 more | 1998-06-16 |
| 5472563 | Printed circuit board and method and apparatus for making same | Kiyonori Kogawa, Nobuaki Ooki, Masami Kawaguchi, Haruo Akahoshi, Akira Nagai | 1995-12-05 |
| 5113477 | Plastic optical fibers from polymers derived from metallic salts of ethylenic carboxyl monomers | Shuji Eguchi, Noriaki Taketani, Seikichi Tanno, Yoshiaki Okabe, Hiromu Terao +2 more | 1992-05-12 |
| 5028513 | Process for producing printed circuit board | Kanji Murakami, Mineo Kawamoto, Akio Tadokoro, Haruo Akahoshi, Toshikazu Narahara +3 more | 1991-07-02 |
| 5021296 | Circuit board and process for producing the same | Yoshihiro Suzuki, Toshinari Takada, Masahiro Suzuki, Haruo Akahoshi, Akira Nagai +4 more | 1991-06-04 |
| 4933228 | Thermosetting resin and prepreg and laminate using the same | Junichi Katagiri, Akira Nagai, Keiko Tawara, Akio Takahashi, Toshikazu Narahara +1 more | 1990-06-12 |
| 4886858 | Thermosetting resin and prepreg and laminate using the same | Junichi Katagiri, Akira Nagai, Keiko Tawara, Akio Takahashi, Toshikazu Narahara +1 more | 1989-12-12 |
| 4820549 | Photo-curable resist resin composition for electroless plating, process for preparing a printed circuit board with the said resist resin composition and a printed circuit board having resist prepared from the said resist resin composition | Kiyoshi Ozaki, Atsushi Mori, Hideo Tsuda, Mineo Kawamoto, Kanji Murakami | 1989-04-11 |
| 4784917 | Thermosetting resin composition and laminate and process for the production thereof | Keiko Tawara, Akira Nagai, Akio Takahashi, Katuo Sugawara, Masahiro Ono +2 more | 1988-11-15 |
| 4752641 | Thermosetting resin composition and prepolymer obtained therefrom | Toru Koyama, Hiroko Ohayashi, Junichi Katagiri, Junji Mukai | 1988-06-21 |
| 4738900 | Thermo-setting, polymerizable composition and wiring board | Masahiro Ono, Akio Takahashi, Katuo Sugawara, Ritsuro Tada, Akira Nagai +1 more | 1988-04-19 |
| 4710854 | Hybrid multilayer wiring board | Minoru Yamada, Akira Masaki, Akio Takahashi, Keiichirou Nakanishi, Katuo Sugawara | 1987-12-01 |
| 4661417 | Composite of metal and resin having electrolytically reduced metal layer and process for producing the same | Yoshihiro Suzuki, Nobuhiro Satoh, Toshikazu Narahara, Takeshi Shimazaki | 1987-04-28 |
| 4642161 | Method of bonding copper and resin | Haruo Akahoshi, Kanji Murakami, Kiyonori Kogawa, Ritsuji Toba, Takeshi Shimazaki | 1987-02-10 |
| 4632852 | Process for electroless copper plating | Haruo Akahoshi, Kanji Murakami, Mineo Kawamoto, Rituji Toba, Shoji Kawakubo +1 more | 1986-12-30 |
| 4610910 | Printed circuit board, process for preparing the same and resist ink used therefor | Mineo Kawamoto, Kanji Murakami, Haruo Akahoshi, Yoichi Matsuda, Makoto Matsunaga +4 more | 1986-09-09 |
| 4607094 | Thermosetting resin composition from aromatic cyanamide | Katuo Sugawara, Akio Takahashi, Masahiro Ono, Ritsuro Tada, Toshikazu Narahara +1 more | 1986-08-19 |
| 4604160 | Method for manufacture of printed wiring board | Kanji Murakami, Haruo Akahoshi, Mineo Kawamoto, Yoichi Matsuda, Kyoji Kawakubo +3 more | 1986-08-05 |
| 4587162 | Resin composition and laminate produced therefrom comprising a cyclized polybutadiene and a prepolymer of a isocyanuric or cyanuric acid derivative | Akira Nagai, Akio Takahashi, Katuo Sugawara, Masahiro Ono, Ritsuro Tada +1 more | 1986-05-06 |
| 4585841 | Transparent resin material containing metallic atoms bonded to pendent carboxylic acid groups | Shuji Eguchi, Noriaki Taketani, Hideki Asano | 1986-04-29 |
| 4546168 | Thermosetting resin composition comprising (1) dicyanamide, (2) polyvalent imide and (3) polymerizable compound | Akio Takahashi, Takeshi Shimazaki, Hirosada Morishita | 1985-10-08 |
| 4526835 | Multi-layer printed circuit board and process for production thereof | Akio Takahashi, Takeshi Shimazaki, Hirosada Morishita | 1985-07-02 |
| 4486583 | Heat-resistant resin from aromatic cyanamide compound and aromatic amine compound | Akio Takahashi, Masahiro Ono, Ritsuro Tada, Hirosada Morishita | 1984-12-04 |
| 4482703 | Thermosetting resin composition comprising dicyanamide and polyvalent imide | Akio Takahashi, Takeshi Shimazaki, Hirosada Morishita | 1984-11-13 |
| 4457952 | Process for producing printed circuit boards | Mineo Kawamoto, Kanji Murakami, Yutaka Itoh, Youichi Matsuda, Hirosada Morishita +2 more | 1984-07-03 |