Issued Patents All Time
Showing 1–18 of 18 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8247725 | Vacuum switchgear | Ayumu Morita, Takashi Sato, Tomoaki Utsumi, Makoto Yano, Kenji Tsuchiya +2 more | 2012-08-21 |
| 6730911 | Method and apparatus for paper material discrimination with two near-infrared lights | Toshiro Uemura, Yoshitaka Takezawa, Mitsunari Kano, Eiji Mizuno | 2004-05-04 |
| 6633035 | Water content-measurement method and water content-measurement apparatus, and electrical component-fabrication method using the measurement apparatus and method | Yoshitaka Takezawa, Yuzo Ito | 2003-10-14 |
| 5849460 | Photosensitive resin composition and method for using the same in manufacture of circuit boards | Yoshinori Kawai, Mineo Kawamoto, Masanori Nemoto, Akio Takahashi | 1998-12-15 |
| 5707749 | Method for producing thin film multilayer wiring board | Akio Takahashi, Akira Nagai, Haruo Akahoshi, Kouji Fujisaki, Akio Mukoh +1 more | 1998-01-13 |
| 5565706 | LSI package board | Osamu Miura, Akio Takahashi, Takao Miwa, Masahiro Suzuki, Ryuji Watanabe +3 more | 1996-10-15 |
| 5352762 | Multilayer printed circuit board and production thereof | Akira Nagai, Shin Nishimura, Masahiro Suzuki, Masao Suzuki, Akio Takahashi +1 more | 1994-10-04 |
| 5308888 | Fluorine-containing curable resin composition and use thereof | Shin Nishimura, Akira Nagai, Akio Takahashi, Akio Mukoo, Tadashi Narita +2 more | 1994-05-03 |
| 5223594 | Flame-retardant resin composition containing a bromostyrene prepolymer | Akira Nagai, Masahiro Ono, Masao Suzuki, Akio Takahashi, Toshikazu Narahara | 1993-06-29 |
| 5212244 | Thermosetting resin composition, and prepreg and laminated sheet which use the same | Katuo Sugawara, Akio Takahashi, Akira Nagai, Masahiro Ono, Toshikazu Narahara | 1993-05-18 |
| 5080965 | Prepreg from poly(p-hydroxystyrene), epoxy-modified polybutadiene and maleimide | Katuo Sugawara, Akio Takahashi, Akira Nagai, Masahiro Ono, Toshikazu Narahara | 1992-01-14 |
| 5065285 | Multi-layer circuit board, method of manufacturing the same and application thereof | Akira Nagai, Katuo Sugawara, Masahiro Suzuki, Akio Takahashi | 1991-11-12 |
| 5045381 | Thermosetting resin composition, printed circuit board using the resin composition and process for producing printed circuit board | Masao Suzuki, Akira Nagai, Masahiro Suzuki, Akio Takahashi | 1991-09-03 |
| 4933228 | Thermosetting resin and prepreg and laminate using the same | Akira Nagai, Keiko Tawara, Akio Takahashi, Motoyo Wajima, Toshikazu Narahara +1 more | 1990-06-12 |
| 4931507 | Composition comprising poly(p-hydroxystrene) derivative, epoxy-modified polybutadiene and aromatic maleimide | Katuo Sugawara, Akio Takahashi, Akira Nagai, Masahiro Ono, Toshikazu Narahara | 1990-06-05 |
| 4886858 | Thermosetting resin and prepreg and laminate using the same | Akira Nagai, Keiko Tawara, Akio Takahashi, Motoyo Wajima, Toshikazu Narahara +1 more | 1989-12-12 |
| 4752641 | Thermosetting resin composition and prepolymer obtained therefrom | Toru Koyama, Hiroko Ohayashi, Motoyo Wajima, Junji Mukai | 1988-06-21 |
| 4211686 | Unsaturated polyester resin composition for use in pressure molding | Akio Nishikawa, Noriyuki Kinjo, Hitoshi Yokono, Tamotsu Ikeda, Tsuguo Kobayashi | 1980-07-08 |