Issued Patents All Time
Showing 26–34 of 34 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 4448940 | Thermosetting resin composition and prepolymer thereof | Tohru Koyama, Junji Mukai | 1984-05-15 |
| 4400438 | Process for producing fire retardant and heat resistant copper-clad laminated board, and varnish therefor | Akio Takahashi, Yutaka Itoh, Takeshi Shimazaki, Hirosada Morishita, Yutaka Mizuno +2 more | 1983-08-23 |
| 4393188 | Thermosetting prepolymer from polyfunctional maleimide and bis maleimide | Akio Takahashi, Ritsuro Tada, Hirosada Morishita, Yutaka Mizuno, Shunya Yokozawa +1 more | 1983-07-12 |
| 4378384 | Process for producing printed circuit board by electroless plating | Kanji Murakami, Mineo Kawamoto, Yutaka Itoh, Youichi Matsuda, Shoji Kawakubo +1 more | 1983-03-29 |
| 4346206 | Imide prepolymer from reaction of epoxy compound with bis-imide/diamine reaction mixture | Akio Takahashi, Yutaka Itoh, Takeshi Shimazaki, Hirosada Morishita, Yutaka Mizuno +2 more | 1982-08-24 |
| 4343659 | Process for producing copper barrier type, nuclear fuel cladding | Kanji Murakami, Tetsuo Ishikawa | 1982-08-10 |
| 4296219 | Bismide-ether compounds, compositions thereof, and method of producing same | Akio Takahashi, Yutaka Itoh, Hirosada Morishita, Akio Nishikawa | 1981-10-20 |
| 4283522 | Process for preparing thermosetting prepolymer from mixture of polyfunctional maleimide and bis-maleimide | Akio Takahashi, Yutaka Itoh, Hirosada Morishita, Kenji Tsukanishi | 1981-08-11 |
| 4239813 | Process for forming printed wiring by electroless deposition | Kanji Murakami, Mineo Kawamoto, Yoichi Matsuda, Hirosada Morishita | 1980-12-16 |