Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5356698 | Adhesive agent for substrate of electroless plating, printed circuit board using same, and method of producing same | Mineo Kawamoto, Haruo Akahoshi, Akio Takahashi, Akio Mukoh, Kazuo Tanje +3 more | 1994-10-18 |
| 4876177 | Process for producing printed circuit board | Haruo Akahoshi, Kanji Murakami, Mineo Kawamoto, Akio Tadokoro | 1989-10-24 |
| 4865888 | Process for electroless copper plating and apparatus used therefor | Haruo Akahoshi, Kanji Murakami, Mineo Kawamoto, Akio Takokoro, Ritsuji Toba | 1989-09-12 |
| 4610910 | Printed circuit board, process for preparing the same and resist ink used therefor | Mineo Kawamoto, Kanji Murakami, Haruo Akahoshi, Yoichi Matsuda, Motoyo Wajima +4 more | 1986-09-09 |
| 4604160 | Method for manufacture of printed wiring board | Kanji Murakami, Haruo Akahoshi, Mineo Kawamoto, Motoyo Wajima, Yoichi Matsuda +3 more | 1986-08-05 |
| 4457952 | Process for producing printed circuit boards | Mineo Kawamoto, Kanji Murakami, Yutaka Itoh, Youichi Matsuda, Motoyo Wajima +2 more | 1984-07-03 |
| 4378384 | Process for producing printed circuit board by electroless plating | Kanji Murakami, Mineo Kawamoto, Yutaka Itoh, Youichi Matsuda, Motoyo Wajima +1 more | 1983-03-29 |
| 4324629 | Process for regenerating chemical copper plating solution | Hitoshi Oka, Hiroshi Kikuchi, Hitoshi Yokono, Haruo Suzuki, Akira Matsuo +3 more | 1982-04-13 |