Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7588835 | Method of treating the surface of copper and copper | Tomoaki Yamashita, Yasuo Inoue, Masaharu Matsuura, Akira Shimizu, Fumio Inoue +1 more | 2009-09-15 |
| 5879568 | Process for producing multilayer printed circuit board for wire bonding | Naoyuki Urasaki, Kouichi Tsuyama, Kazuhito Kobayashi, Norio Okano, Hiroshi Shimizu +6 more | 1999-03-09 |