Issued Patents All Time
Showing 26–27 of 27 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 4548644 | Electroless copper deposition solution | Kiyoshi Yamanoi, Toshiro Okamura, Yoshiyuki Tsuru | 1985-10-22 |
| 4216246 | Method of improving adhesion between insulating substrates and metal deposits electrolessly plated thereon, and method of making additive printed circuit boards | Yorio Iwasaki, Toshiro Okamura, Nobuo Uozu, Hiroshi Takahashi | 1980-08-05 |