Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6156870 | Resin composition which can be cured by application of heat or irradiation of light, film, laminate and production of multilayer wiring board | Masaki Morita, Shin Takanezawa, Kazumasa Takeuchi, Shuuichi Hatakeyama | 2000-12-05 |
| 5532105 | Photolithographically viahole-forming photosensitive element comprising two photosensitive layers for the fabrication process of multilayer wiring board | Kazumasa Takeuchi, Ritsuko Obata, Naoki Fukutomi, Kazuko Suzuki | 1996-07-02 |
| 4454219 | Photosensitive resin composition comprised of a polymer obtained from an aliphatic amino group-containing monomer as a comonomer | Nobuyuki Hayashi | 1984-06-12 |