Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6156870 | Resin composition which can be cured by application of heat or irradiation of light, film, laminate and production of multilayer wiring board | Masaki Morita, Shin Takanezawa, Takashi Yamadera, Kazumasa Takeuchi | 2000-12-05 |