MY

Masami Yusa

HC Hitachi Chemical Company: 34 patents #6 of 1,946Top 1%
Sharp Kabushiki Kaisha: 2 patents #5,184 of 10,731Top 50%
HI Hitachi: 1 patents #17,742 of 28,497Top 65%
📍 Chikusei, JP: #3 of 185 inventorsTop 2%
Overall (All Time): #99,100 of 4,157,543Top 3%
35
Patents All Time

Issued Patents All Time

Showing 26–35 of 35 patents

Patent #TitleCo-InventorsDate
6099678 Laminating method of film-shaped organic die-bonding material, die-bonding method, laminating machine and die-bonding apparatus, semiconductor device, and fabrication process of semiconductor device Akio Kotato, Yuusuke Miyamae, Tadaji Satou, Makoto Saitou, Tooru Kikuchi +7 more 2000-08-08
6064111 Substrate for holding a chip of semi-conductor package, semi-conductor package, and fabrication process of semi-conductor package Yoshiki Sota, Koji Miyata, Toshio Yamazaki, Fumio Inoue, Hidehiro Nakamura +4 more 2000-05-16
5667899 Electrically conductive bonding films Shinji Takeda, Takashi Masuko, Yasuo Miyadera, Mitsuo Yamazaki 1997-09-16
5605763 Electrically conductive bonding films Shinji Takeda, Takashi Masuko, Yasuo Miyadera, Mitsuo Yamazaki 1997-02-25
5571579 Alignment film for liquid crystal, liquid crystal-sandwiched panel, liquid crystal display module and material for liquid crystal alignment film Toshihiko Kato, Nobuo Miyadera, Hideyuki Hashimoto, Yasuo Miyadera, Masahiro Kawakami 1996-11-05
5401878 Fluorine-containing polyimides and precursors thereof Shinji Takeda, Yasuo Miyadera 1995-03-28
5270438 Fluorine-containing polyimides and precursors thereof Shinji Takeda, Yasuo Miyadera 1993-12-14
5243019 Alkenyl-fluorine-containing aromatic polyamide Shinji Takeda, Yasuo Miyadera 1993-09-07
5115089 Processes for preparation of polyimide-isoindroquinazolinedione and precursor thereof Masatoshi Yoshida, Katsuji Shibata, Mitsumasa Kojima, Hidetaka Satou, Toshihiko Kato +1 more 1992-05-19
4833204 Epoxy resin composition for a copper-clad laminate Katsuji Shibata, Yasuo Miyadera 1989-05-23