Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8696942 | Adhesive composition, circuit connecting material, connection structure of circuit member, and semiconductor device | Shigeki Katogi, Hiroyuki Izawa, Masami Yusa, Tohru Fujinawa | 2014-04-15 |
| 8518303 | Adhesive composition, circuit connecting material, connection structure of circuit member, and semiconductor device | Shigeki Katogi, Hiroyuki Izawa, Masami Yusa, Tohru Fujinawa | 2013-08-27 |
| 8309658 | Adhesive composition, circuit connecting material, connecting structure for circuit member, and semiconductor device | Shigeki Katogi, Hiroyuki Izawa, Toshiaki Shirasaka, Masami Yusa, Takanobu Kobayashi | 2012-11-13 |
| 8138268 | Adhesive composition, circuit connecting material, connecting structure for circuit member, and semiconductor device | Shigeki Katogi, Hiroyuki Izawa, Toshiaki Shirasaka, Masami Yusa, Takanobu Kobayashi | 2012-03-20 |