Issued Patents All Time
Showing 1–16 of 16 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12426164 | Semiconductor package | Masaya TOBA, Kazuhiko Kurafuchi, Takashi Masuko, Shinichiro Abe | 2025-09-23 |
| 12405198 | Photosensitive resin composition, method for selecting photosensitive resin composition, method for producing patterned cured film, and method for producing semiconductor device | Yuki IMAZU, Yu Aoki, Takuya KOMINE | 2025-09-02 |
| 12376235 | Layered plate and wiring base board production method | Masaya TOBA, Masaki Yamaguchi | 2025-07-29 |
| 12114437 | Wiring structure, method for manufacturing same, and semiconductor package | Masaya TOBA | 2024-10-08 |
| 12004305 | Wiring board and production method for same | Masaya TOBA, Kazuhiko Kurafuchi, Takashi Masuko, Shinichiro Abe | 2024-06-04 |
| 11990396 | Substrate and method for manufacturing the same | Masaya TOBA, Yoshinori Ejiri, Kazuhiko Kurafuchi | 2024-05-21 |
| 11979990 | Wiring board and method for manufacturing the same | Masaya TOBA, Kazuhiko Kurafuchi, Takashi Masuko, Shinichiro Abe | 2024-05-07 |
| 11562951 | Organic interposer and method for manufacturing organic interposer | Masaya TOBA, Yoshinori Ejiri, Kazuhiko Kurafuchi | 2023-01-24 |
| 10756008 | Organic interposer and method for manufacturing organic interposer | Masaya TOBA, Yoshinori Ejiri, Kazuhiko Kurafuchi | 2020-08-25 |
| 10575402 | Resin composition, wiring layer laminate for semiconductor, and semiconductor device | Shinichiro Abe, Kazuhiko Kurafuchi, Tomonori Minegishi, Masaya TOBA | 2020-02-25 |
| 10428253 | Photosensitive resin composition, film adhesive, adhesive sheet, adhesive pattern, semiconductor wafer with adhesive layer, and semiconductor device | Tomonori Minegishi | 2019-10-01 |
| 10388608 | Semiconductor device and method for manufacturing same | Masaya TOBA, Kenichi IWASHITA, Kohsuke URASHIMA, Kazuhiko Kurafuchi | 2019-08-20 |
| 9309446 | Photosensitive adhesive composition, film-like adhesive, adhesive sheet, adhesive pattern, semiconductor wafer with adhesive layer, semiconductor device | Takashi Kawamori, Takashi Masuko, Shigeki Katogi | 2016-04-12 |
| 8507323 | Method of producing semiconductor device with patterned photosensitive adhesive | Takashi Masuko, Takashi Kawamori, Shigeki Katogi | 2013-08-13 |
| 8349700 | Photosensitive adhesive, semiconductor device and method for manufacturing semiconductor device | Takashi Masuko, Takashi Kawamori, Shigeki Katogi | 2013-01-08 |
| 8258017 | Photosensitive adhesive | Takashi Masuko, Takashi Kawamori, Shigeki Katogi | 2012-09-04 |