Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12246398 | Solder bump forming member, method for manufacturing solder bump forming member, and method for manufacturing electrode substrate provided with solder bump | Kunihiko Akai, Masayuki Miyaji, Yoshinori Ejiri | 2025-03-11 |
| 12100923 | Connection structure and manufacturing method therefor | Kunihiko Akai, Masayuki Miyaji, Yoshinori Ejiri, Toshimitsu MORIYA | 2024-09-24 |