Issued Patents All Time
Showing 1–20 of 20 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11999875 | Polishing solution and polishing method | Yuya Otsuka, Shingo Kobayashi, Mayumi KOMINE, Hisato Takahashi | 2024-06-04 |
| 11578236 | Slurry, polishing-liquid set, polishing liquid, and polishing method for base | Tomohiro Iwano, Keita ARAKAWA, Takahiro Hidaka | 2023-02-14 |
| 11046869 | Polishing liquid, polishing liquid set, and substrate polishing method | Toshiaki Akutsu, Tomohiro Iwano, Tetsuro Yamashita, Masako AOKI, Masato Fukasawa | 2021-06-29 |
| 10796921 | CMP fluid and method for polishing palladium | Ryouta Saisyo, Jin Amanokura, Yuuhei Okada, Hiroshi Ono | 2020-10-06 |
| 10759968 | Abrasive, abrasive set, and method for polishing substrate | Tomohiro Iwano, Toshiaki Akutsu | 2020-09-01 |
| 10752807 | Slurry, polishing-liquid set, polishing liquid, method for polishing substrate, and substrate | Tomohiro Iwano, Keita ARAKAWA, Takahiro Hidaka | 2020-08-25 |
| 10557059 | Slurry, polishing-solution set, polishing solution, substrate polishing method, and substrate | Tomohiro Iwano, Toshiaki Akutsu, Koji Fujisaki | 2020-02-11 |
| 10557058 | Polishing agent, polishing agent set, and substrate polishing method | Toshiaki Akutsu, Tomohiro Iwano, Koji Fujisaki | 2020-02-11 |
| 10549399 | Slurry, polishing-solution set, polishing solution, substrate polishing method, and substrate | Tomohiro Iwano, Toshiaki Akutsu, Koji Fujisaki | 2020-02-04 |
| 10196542 | Abrasive, abrasive set, and method for abrading substrate | Toshiaki Akutsu, Tomohiro Iwano, Koji Fujisaki | 2019-02-05 |
| 10155886 | Polishing liquid for CMP, and polishing method | Munehiro Oota, Toshio Takizawa, Toshiaki Akutsu, Tomohiro Iwano | 2018-12-18 |
| 10030172 | Abrasive, abrasive set, and method for polishing substrate | Tomohiro Iwano, Toshiaki Akutsu | 2018-07-24 |
| 9932497 | Slurry, polishing-solution set, polishing solution, substrate polishing method, and substrate | Tomohiro Iwano, Toshiaki Akutsu, Koji Fujisaki | 2018-04-03 |
| 9799532 | CMP polishing solution and polishing method | Jin Amanokura, Sou Anzai | 2017-10-24 |
| 9447306 | CMP polishing fluid, method for manufacturing same, method for manufacturing composite particle, and method for polishing base material | Keisuke Inoue, Chisato KIKKAWA, Yutaka Nomura, Tomohiro Iwano | 2016-09-20 |
| 9346978 | Slurry, polishing-solution set, polishing solution, substrate polishing method, and substrate | Tomohiro Iwano, Toshiaki Akutsu, Koji Fujisaki | 2016-05-24 |
| 9346977 | Abrasive, abrasive set, and method for abrading substrate | Toshiaki Akutsu, Tomohiro Iwano, Koji Fujisaki | 2016-05-24 |
| 9163162 | Polishing agent, polishing agent set and method for polishing base | Toshiaki Akutsu, Tomohiro Iwano, Koji Fujisaki | 2015-10-20 |
| 9039796 | Method for producing abrasive grains, method for producing slurry, and method for producing polishing liquid | Tomohiro Iwano, Hirotaka Akimoto | 2015-05-26 |
| 8900473 | Polishing solution for CMP, and method for polishing substrate using the polishing solution for CMP | Ryouta Saisyo, Hiroshi Ono | 2014-12-02 |