Issued Patents All Time
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11046869 | Polishing liquid, polishing liquid set, and substrate polishing method | Hisataka Minami, Tomohiro Iwano, Tetsuro Yamashita, Masako AOKI, Masato Fukasawa | 2021-06-29 |
| 10759968 | Abrasive, abrasive set, and method for polishing substrate | Hisataka Minami, Tomohiro Iwano | 2020-09-01 |
| 10557059 | Slurry, polishing-solution set, polishing solution, substrate polishing method, and substrate | Tomohiro Iwano, Hisataka Minami, Koji Fujisaki | 2020-02-11 |
| 10557058 | Polishing agent, polishing agent set, and substrate polishing method | Hisataka Minami, Tomohiro Iwano, Koji Fujisaki | 2020-02-11 |
| 10549399 | Slurry, polishing-solution set, polishing solution, substrate polishing method, and substrate | Tomohiro Iwano, Hisataka Minami, Koji Fujisaki | 2020-02-04 |
| 10196542 | Abrasive, abrasive set, and method for abrading substrate | Hisataka Minami, Tomohiro Iwano, Koji Fujisaki | 2019-02-05 |
| 10155886 | Polishing liquid for CMP, and polishing method | Munehiro Oota, Toshio Takizawa, Hisataka Minami, Tomohiro Iwano | 2018-12-18 |
| 10030172 | Abrasive, abrasive set, and method for polishing substrate | Hisataka Minami, Tomohiro Iwano | 2018-07-24 |
| 9932497 | Slurry, polishing-solution set, polishing solution, substrate polishing method, and substrate | Tomohiro Iwano, Hisataka Minami, Koji Fujisaki | 2018-04-03 |
| 9346977 | Abrasive, abrasive set, and method for abrading substrate | Hisataka Minami, Tomohiro Iwano, Koji Fujisaki | 2016-05-24 |
| 9346978 | Slurry, polishing-solution set, polishing solution, substrate polishing method, and substrate | Tomohiro Iwano, Hisataka Minami, Koji Fujisaki | 2016-05-24 |
| 9293344 | Cmp polishing slurry and method of polishing substrate | Masato Fukasawa, Naoyuki Koyama, Yasushi Kurata, Kouji Haga, Yuuto Ootsuki | 2016-03-22 |
| 9163162 | Polishing agent, polishing agent set and method for polishing base | Hisataka Minami, Tomohiro Iwano, Koji Fujisaki | 2015-10-20 |
| 8900335 | CMP polishing slurry and method of polishing substrate | Masato Fukasawa, Naoyuki Koyama, Kouji Haga | 2014-12-02 |