KH

Kouji Haga

HC Hitachi Chemical Company: 12 patents #116 of 1,946Top 6%
Overall (All Time): #417,030 of 4,157,543Top 15%
12
Patents All Time

Issued Patents All Time

Showing 1–12 of 12 patents

Patent #TitleCo-InventorsDate
10037894 Polishing liquid for metal and polishing method Yasuhiro ICHIGE, Seiichi Kondo 2018-07-31
9293344 Cmp polishing slurry and method of polishing substrate Masato Fukasawa, Naoyuki Koyama, Yasushi Kurata, Toshiaki Akutsu, Yuuto Ootsuki 2016-03-22
8900335 CMP polishing slurry and method of polishing substrate Masato Fukasawa, Naoyuki Koyama, Toshiaki Akutsu 2014-12-02
8734204 Polishing solution for metal films and polishing method using the same Masato Fukasawa, Hiroshi Nakagawa, Kouji Mishima 2014-05-27
8501625 Polishing liquid for metal film and polishing method Masato Fukasawa, Jin Amanokura, Hiroshi Nakagawa 2013-08-06
8231735 Polishing slurry for chemical mechanical polishing and method for polishing substrate Yuto Ootsuki, Yasushi Kurata, Kazuhiro Enomoto 2012-07-31
8168541 CMP polishing slurry and polishing method Masato Fukasawa, Masato Yoshida, Naoyuki Koyama, Yuto Ootsuki, Chiaki Yamagishi +2 more 2012-05-01
8002860 CMP abrasive, method for polishing substrate and method for manufacturing semiconductor device using the same, and additive for CMP abrasive Naoyuki Koyama, Masato Yoshida, Keizou Hirai, Toranosuke Ashizawa, Youiti Machii 2011-08-23
7837800 CMP polishing slurry and polishing method Masato Fukasawa, Masato Yoshida, Naoyuki Koyama, Yuto Ootsuki, Chiaki Yamagishi +2 more 2010-11-23
7838482 CMP polishing compound and polishing method Masato Fukasawa, Masato Yoshida, Naoyuki Koyama, Yuto Ootsuki, Chiaki Yamagishi +2 more 2010-11-23
7410409 Abrasive compound for CMP, method for polishing substrate and method for manufacturing semiconductor device using the same, and additive for CMP abrasive compound Naoyuki Koyama, Masato Yoshida, Keizou Hirai, Toranosuke Ashizawa, Youiti Machii 2008-08-12
7311855 Polishing slurry for chemical mechanical polishing and method for polishing substrate Yuto Ootsuki, Yasushi Kurata, Kazuhiro Enomoto 2007-12-25