Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12168709 | Thermosetting resin composition, prepreg, laminate, metal-clad laminate, printed wiring board, and high-speed communication compatible module | Koji Morita, Ryo Shimokawa, Shinji Tsuchikawa, Chihiro Hayashi, Tomio Iwasaki | 2024-12-17 |
| 10343306 | Organic material removing device | Shinichi Kawasumi, Kazuhito Kobayashi | 2019-07-09 |