Issued Patents All Time
Showing 26–29 of 29 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5309632 | Process for producing printed wiring board | Hiroshi Takahashi, Masao Kanno, Yorio Iwasaki, Toshirou Okamura, Akishi Nakaso +1 more | 1994-05-10 |
| 5153987 | Process for producing printed wiring boards | Hiroshi Takahashi, Masao Kanno, Toshiro Okamura, Naoki Fukutomi, Hiroyoshi Yokoyama +4 more | 1992-10-13 |
| 5053280 | Adhesive composition for printed wiring boards with acrylonitrile-butadiene rubber having carboxyl groups and 20 PPM or less metal ionic impurities; an alkyl phenol resin; an epoxy resin; palladium catalyst, and coupling agent | Yorio Iwasaki, Hiroshi Takaahashi, Toshiro Okamura, Saburo Amano, Hiroyoshi Yokoyama +2 more | 1991-10-01 |
| 4837086 | Adhesive clad insulating substrate used for producing printed circuit boards | Hiroshi Takahashi, Naohiro Morozumi, Kiyoshi Nakao | 1989-06-06 |