Issued Patents All Time
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6824888 | Bonded body comprising beryllium member and copper or copper alloy member, and method of manufacturing the same | Toshihisa Hatano, Minoru Uda | 2004-11-30 |
| 6777720 | Semiconductor light-emitting element having first and second epitaxial layer group II-VI semiconductor compounds on a substrate | Takafumi Yao, Hiromitsu Uchiyama | 2004-08-17 |
| 6286750 | Method of manufacturing beryllium-copper alloy hot isostatic press (HIP) bonded body and hip-bonded body | — | 2001-09-11 |
| 6176418 | Composite bonding material of beryllium, copper alloy and stainless steel and composite bonding method | — | 2001-01-23 |
| 6164524 | HIP-bonded body and method of producing the same | — | 2000-12-26 |
| 5354388 | Production of beryllium-copper alloys and beryllium copper alloys produced thereby | Keigo Nojiri | 1994-10-11 |
| 5131958 | Method of hot forming beryllium-copper alloy and hot formed product thereof | Taku Sakai, Naokuni Muramatsu | 1992-07-21 |
| 5074922 | Method of producing beryllium copper alloy member | Hiroyuki Hiramitsu, Tomoyuki Maebashi | 1991-12-24 |
| 4935202 | Electrically conductive spring materials | — | 1990-06-19 |
| 4792365 | Production of beryllium-copper alloys and alloys produced thereby | Yosuke Matsui, Shuhei Ishikawa | 1988-12-20 |
| 4696704 | Material for lead frames | Kazumasa Takeuchi, Kazuo Ikushima | 1987-09-29 |
| 4692192 | Electroconductive spring material | Kazuo Ikushima, Syuhei Ishikawa | 1987-09-08 |