Issued Patents All Time
Showing 1–20 of 20 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8937390 | Semiconductor device having a liquid cooling module | Nae Hisano, Shigeo Ohashi, Yasuo Osone, Yasuhiro Naka, Kunihiko Nishi +4 more | 2015-01-20 |
| 8704352 | Semiconductor device having a liquid cooling module | Nae Hisano, Shigeo Ohashi, Yasuo Osone, Yasuhiro Naka, Kunihiko Nishi +4 more | 2014-04-22 |
| 8334465 | Wafer of circuit board and joining structure of wafer or circuit board | Masakazu Ishino, Hiroaki Ikeda, Hideharu Miyake, Shiro Uchiyama, Kunihiko Nishi +2 more | 2012-12-18 |
| 7754581 | Method for manufacturing a three-dimensional semiconductor device and a wafer used therein | Hiroaki Ikeda, Masakazu Ishino, Naoya Kanda, Yasuhiro Naka, Kunihiko Nishi | 2010-07-13 |
| 7618847 | Bonding method of semiconductor and laminated structure fabricated thereby | Kunihiko Nishi, Yasuhiro Naka, Nae Hisano, Hiroaki Ikeda, Masakazu Ishino | 2009-11-17 |
| 7378333 | Semiconductor device and manufacturing method thereof | Toshiya Satoh, Masahiko Ogino, Tadanori Segawa, Yoshihide Yamaguchi, Atsushi Kazama +2 more | 2008-05-27 |
| 7084498 | Semiconductor device having projected electrodes and structure for mounting the same | Yoshihide Yamaguchi, Shigeharu Tsunoda, Hiroshi Hozoji, Naoya Kanda | 2006-08-01 |
| 7057283 | Semiconductor device and method for producing the same | Kosuke Inoue, Yoshihide Yamaguchi, Noriyuki Oroku, Hiroshi Hozoji, Shigeharu Tsunoda +6 more | 2006-06-06 |
| 7002250 | Semiconductor module | Hiroshi Hozoji, Yoshihide Yamaguchi, Naoya Kanda, Shigeharu Tunoda | 2006-02-21 |
| 6998713 | Wiring board and method for producing same | Yasumori Narizuka, Mitsuko Itou, Yoshihide Yamaguchi | 2006-02-14 |
| 6946723 | Semiconductor device and manufacturing method thereof | Toshiya Satoh, Masahiko Ogino, Tadanori Segawa, Yoshihide Yamaguchi, Atsushi Kazama +2 more | 2005-09-20 |
| 6930388 | Semiconductor device and method for manufacturing the same and semiconductor device-mounted structure | Yoshihide Yamaguchi, Kosuke Inoue, Noriyuki Oroku, Hiroshi Hozoji, Shigeharu Tsunoda +6 more | 2005-08-16 |
| 6822317 | Semiconductor apparatus including insulating layer having a protrusive portion | Kosuke Inoue, Yoshihide Yamaguchi, Noriyuki Oroku, Hiroshi Hozoji, Shigeharu Tsunoda +6 more | 2004-11-23 |
| 6791178 | Multi-chip module including semiconductor devices and a wiring substrate for mounting the semiconductor devices | Yoshihide Yamaguchi, Takao Terabayashi, Hiroshi Hozoji, Naoya Kanda | 2004-09-14 |
| 6780748 | Method of fabricating a wafer level chip size package utilizing a maskless exposure | Yoshihide Yamaguchi, Hiroshi Hozoji, Naoya Kanda | 2004-08-24 |
| 6770547 | Method for producing a semiconductor device | Kosuke Inoue, Yoshihide Yamaguchi, Noriyuki Oroku, Hiroshi Hozoji, Shigeharu Tsunoda +6 more | 2004-08-03 |
| 6756688 | Wiring board and its production method, semiconductor device and its production method, and electronic apparatus | Yasumori Narizuka, Mitsuko Itou, Yoshihide Yamaguchi | 2004-06-29 |
| 6624504 | Semiconductor device and method for manufacturing the same | Kosuke Inoue, Yoshihide Yamaguchi, Noriyuki Oroku, Hiroshi Hozoji, Shigeharu Tsunoda +6 more | 2003-09-23 |
| 6610934 | Semiconductor module and method of making the device | Yoshihide Yamaguchi, Takao Terabayashi, Hiroshi Hozoji, Naoya Kanda | 2003-08-26 |
| 6515372 | Wiring board and its production method, semiconductor device and its production method, and electronic apparatus | Yasumori Narizuka, Mitsuko Itou, Yoshihide Yamaguchi | 2003-02-04 |