Issued Patents All Time
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11742252 | Shielded fan-out packaged semiconductor device and method of manufacturing | Fumitomo Watanabe | 2023-08-29 |
| 11335667 | Stacked semiconductor die assemblies with die substrate extensions | Fumitomo Watanabe | 2022-05-17 |
| 11158554 | Shielded fan-out packaged semiconductor device and method of manufacturing | Fumitomo Watanabe | 2021-10-26 |
| 10553566 | Stacked semiconductor die assemblies with die substrate extensions | Fumitomo Watanabe | 2020-02-04 |
| 10453762 | Shielded fan-out packaged semiconductor device and method of manufacturing | Fumitomo Watanabe | 2019-10-22 |
| 10147705 | Stacked semiconductor die assemblies with die substrate extensions | Fumitomo Watanabe | 2018-12-04 |
| 9466546 | Semiconductor device and method of forming the same | Koichi Hatakeyama, Mitsuhisa Watanabe | 2016-10-11 |
| 8816478 | Semiconductor device having penetration electrode penetrating through semiconductor substrate | Yoshiharu Kanegae, Hisashi Tanie, Mitsuhisa Watanabe | 2014-08-26 |
| 8274143 | Semiconductor device, method of forming the same, and electronic device | Hiroyuki Fujishima, Katsumi Sugawara, Koichi Hatakeyama | 2012-09-25 |
| 8217517 | Semiconductor device provided with wire that electrically connects printed wiring board and semiconductor chip each other | Mitsuhisa Watanabe | 2012-07-10 |
| 8203222 | Semiconductor device and method of manufacturing the same | Mitsuhisa Watanabe, Koichi Hatakeyama | 2012-06-19 |
| 7372130 | Semiconductor device including a semiconductor chip formed on an insulating element such as a tape, and including an improved insulating arrangement | Koya Kikuchi, Noriou Shimada, Akihiko Hatasawa, Yutaka Kagaya | 2008-05-13 |
| 7321165 | Semiconductor device and its manufacturing method | Yutaka Kagaya, Koya Kikuchi, Akihiko Hatasawa | 2008-01-22 |