Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10734322 | Through-holes of a semiconductor chip | — | 2020-08-04 |
| 10475746 | Through-holes of a semiconductor chip | — | 2019-11-12 |
| 10115693 | Solder layer of a semiconductor chip arranged within recesses | — | 2018-10-30 |
| 7928551 | Semiconductor device and method of manufacturing the same | Reiko Fujiwara, Fumitomo Watanabe | 2011-04-19 |
| 7372130 | Semiconductor device including a semiconductor chip formed on an insulating element such as a tape, and including an improved insulating arrangement | Koya Kikuchi, Noriou Shimada, Keiyo Kusanagi, Yutaka Kagaya | 2008-05-13 |
| 7321165 | Semiconductor device and its manufacturing method | Yutaka Kagaya, Keiyo Kusanagi, Koya Kikuchi | 2008-01-22 |