Issued Patents All Time
Showing 1–17 of 17 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12119325 | Semiconductor device assemblies with molded support substrates | Mitsuhisa Watanabe, Masanori Yoshida | 2024-10-15 |
| 11742252 | Shielded fan-out packaged semiconductor device and method of manufacturing | Keiyo Kusanagi | 2023-08-29 |
| 11335667 | Stacked semiconductor die assemblies with die substrate extensions | Keiyo Kusanagi | 2022-05-17 |
| 11158554 | Shielded fan-out packaged semiconductor device and method of manufacturing | Keiyo Kusanagi | 2021-10-26 |
| 10998290 | Semiconductor device assemblies with molded support substrates | Mitsuhisa Watanabe, Masanori Yoshida | 2021-05-04 |
| 10553566 | Stacked semiconductor die assemblies with die substrate extensions | Keiyo Kusanagi | 2020-02-04 |
| 10453762 | Shielded fan-out packaged semiconductor device and method of manufacturing | Keiyo Kusanagi | 2019-10-22 |
| 10217719 | Semiconductor device assemblies with molded support substrates | Mitsuhisa Watanabe, Masanori Yoshida | 2019-02-26 |
| 10147705 | Stacked semiconductor die assemblies with die substrate extensions | Keiyo Kusanagi | 2018-12-04 |
| 8810047 | Semiconductor device and method of manufacturing the same | Mitsuhisa Watanabe | 2014-08-19 |
| 8786102 | Semiconductor device and method of manufacturing the same | Masanori Yoshida | 2014-07-22 |
| 8710647 | Semiconductor device having a first conductive member connecting a chip to a wiring board pad and a second conductive member connecting the wiring board pad to a land on an insulator covering the chip and the wiring board | Yutaka Kagaya, Hajime Takasaki | 2014-04-29 |
| 8575763 | Semiconductor device and method of manufacturing the same | Masanori Yoshida | 2013-11-05 |
| 8076770 | Semiconductor device including a first land on the wiring substrate and a second land on the sealing portion | Yutaka Kagaya, Hajime Takasaki | 2011-12-13 |
| 7993975 | Method of manufacturing semiconductor device including mounting and dicing chips | Mitsuhisa Watanabe | 2011-08-09 |
| 7928551 | Semiconductor device and method of manufacturing the same | Reiko Fujiwara, Akihiko Hatasawa | 2011-04-19 |
| 7888179 | Semiconductor device including a semiconductor chip which is mounted spaning a plurality of wiring boards and manufacturing method thereof | Yutaka Kagaya | 2011-02-15 |