| 12119325 |
Semiconductor device assemblies with molded support substrates |
Mitsuhisa Watanabe, Masanori Yoshida |
2024-10-15 |
| 11742252 |
Shielded fan-out packaged semiconductor device and method of manufacturing |
Keiyo Kusanagi |
2023-08-29 |
| 11335667 |
Stacked semiconductor die assemblies with die substrate extensions |
Keiyo Kusanagi |
2022-05-17 |
| 11158554 |
Shielded fan-out packaged semiconductor device and method of manufacturing |
Keiyo Kusanagi |
2021-10-26 |
| 10998290 |
Semiconductor device assemblies with molded support substrates |
Mitsuhisa Watanabe, Masanori Yoshida |
2021-05-04 |
| 10553566 |
Stacked semiconductor die assemblies with die substrate extensions |
Keiyo Kusanagi |
2020-02-04 |
| 10453762 |
Shielded fan-out packaged semiconductor device and method of manufacturing |
Keiyo Kusanagi |
2019-10-22 |
| 10217719 |
Semiconductor device assemblies with molded support substrates |
Mitsuhisa Watanabe, Masanori Yoshida |
2019-02-26 |
| 10147705 |
Stacked semiconductor die assemblies with die substrate extensions |
Keiyo Kusanagi |
2018-12-04 |
| 8810047 |
Semiconductor device and method of manufacturing the same |
Mitsuhisa Watanabe |
2014-08-19 |
| 8786102 |
Semiconductor device and method of manufacturing the same |
Masanori Yoshida |
2014-07-22 |
| 8710647 |
Semiconductor device having a first conductive member connecting a chip to a wiring board pad and a second conductive member connecting the wiring board pad to a land on an insulator covering the chip and the wiring board |
Yutaka Kagaya, Hajime Takasaki |
2014-04-29 |
| 8575763 |
Semiconductor device and method of manufacturing the same |
Masanori Yoshida |
2013-11-05 |
| 8076770 |
Semiconductor device including a first land on the wiring substrate and a second land on the sealing portion |
Yutaka Kagaya, Hajime Takasaki |
2011-12-13 |
| 7993975 |
Method of manufacturing semiconductor device including mounting and dicing chips |
Mitsuhisa Watanabe |
2011-08-09 |
| 7928551 |
Semiconductor device and method of manufacturing the same |
Reiko Fujiwara, Akihiko Hatasawa |
2011-04-19 |
| 7888179 |
Semiconductor device including a semiconductor chip which is mounted spaning a plurality of wiring boards and manufacturing method thereof |
Yutaka Kagaya |
2011-02-15 |
