Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8710647 | Semiconductor device having a first conductive member connecting a chip to a wiring board pad and a second conductive member connecting the wiring board pad to a land on an insulator covering the chip and the wiring board | Yutaka Kagaya, Fumitomo Watanabe | 2014-04-29 |
| 8076770 | Semiconductor device including a first land on the wiring substrate and a second land on the sealing portion | Yutaka Kagaya, Fumitomo Watanabe | 2011-12-13 |