Issued Patents All Time
Showing 1–19 of 19 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9010615 | Bonding apparatus and bonding method | Kazuhiro Yoshimoto, Kazuo Teshirogi, Yoshiaki Shinjo | 2015-04-21 |
| 8444799 | Method for manufacturing semiconductor device and surface protective tape | Hironori Fukaya, Kazuhiro Yoshimoto, Kazuo Teshirogi, Kazuyuki Uragou, Mika Sakamoto +1 more | 2013-05-21 |
| 8440545 | Method of manufacturing semiconductor device with spraying fluid | Hironori Fukaya, Kazuhiro Yoshimoto, Yoshiaki Shinjo, Kazuo Teshirogi, Mika Sakamoto | 2013-05-14 |
| 8016973 | Film bonding method, film bonding apparatus, and semiconductor device manufacturing method | Yoshiaki Shinjo, Kazuo Teshirogi, Kazuhiro Yoshimoto | 2011-09-13 |
| 7857140 | Semiconductor wafer storage case and semiconductor wafer storing method | Yoshiaki Shinjo, Kazuo Teshirogi, Kazuhiro Yoshimoto | 2010-12-28 |
| 7820487 | Manufacturing method of semiconductor device | Kazuo Teshirogi, Kazuhiro Yoshimoto, Yoshiaki Shinjo | 2010-10-26 |
| 7655505 | Manufacturing method of semiconductor device | Kazuo Teshirogi, Kazuhiro Yoshimoto, Yoshiaki Shinjo | 2010-02-02 |
| 7571538 | Vacuum fixing jig for semiconductor device | Kazuo Teshirogi, Kazuhiro Yoshimoto, Mitsuhisa Watanabe, Yoshiaki Shinjo, Eiji Yoshida +1 more | 2009-08-11 |
| 7563343 | Film lamination apparatus and method and a manufacturing method of a semiconductor apparatus | Kazuo Teshirogi, Yoshiaki Shinjo | 2009-07-21 |
| 7479627 | Semiconductor device having transparent member and manufacturing method of the same | Kazuhiro Yoshimoto, Kazuo Teshirogi, Yoshiaki Shinjo | 2009-01-20 |
| 7432114 | Semiconductor device manufacturing method | Kazuo Teshirogi, Kazuhiro Yoshimoto, Yoshiaki Shinjo, Masataka Mizukoshi | 2008-10-07 |
| 7395847 | Jig for a semiconductor substrate | Kazuo Teshirogi, Kazuhiro Yoshimoto, Mitsuhisa Watanabe, Yoshiaki Shinjo, Eiji Yoshida +1 more | 2008-07-08 |
| 7109561 | Method of manufacturing a semiconductor device and a method for fixing the semiconductor device using substrate jig | Kazuo Teshirogi, Kazuhiro Yoshimoto, Mitsuhisa Watanabe, Yoshiaki Shinjo, Eiji Yoshida +1 more | 2006-09-19 |
| 6951800 | Method of making semiconductor device that has improved structural strength | Yoshiaki Shinjo, Kazuo Teshirogi, Kazuhiro Yoshimoto, Eiji Yoshida, Noboru Hayasaka +1 more | 2005-10-04 |
| 6902944 | Method of manufacturing a semiconductor device and a method for fixing the semiconductor device using substrate jig | Kazuo Teshirogi, Kazuhiro Yoshimoto, Mitsuhisa Watanabe, Yoshiaki Shinjo, Eiji Yoshida +1 more | 2005-06-07 |
| 6837776 | Flat-object holder and method of using the same | Kazou Teshirogi, Kazuhiro Yoshimoto, Mitsuhisa Watanabe, Yoshiaki Shinjo, Takashi Mori +2 more | 2005-01-04 |
| 6750074 | Method of manufacturing a semiconductor device and a method for fixing the semiconductor device using substrate jig | Kazuo Teshirogi, Kazuhiro Yoshimoto, Mitsuhisa Watanabe, Yoshiaki Shinjo, Eiji Yoshida +1 more | 2004-06-15 |
| 6673654 | Method of manufacturing semiconductor device using heated conveyance member | Takao Ohno, Koichi Meguro, Shigeru Kamada, Keisuke Fukuda | 2004-01-06 |
| 6461942 | Semiconductor chip removing and conveying method and device | Mitsuhisa Watanabe, Kazuo Teshirogi, Eiji Yoshida, Yoshito Konno, Kyouhei Tamaki | 2002-10-08 |