Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9362173 | Method for chip package | Lei Shi, Yujuan Tao, Guohua Gao, Naomi Masuda | 2016-06-07 |
| 8883627 | Method for chip packaging | Lei Shi, Guohua Gao, Yujuan Tao, Naomi Masuda | 2014-11-11 |
| 7056770 | Method of resin encapsulation, apparatus for resin encapsulation, method of manufacturing semiconductor device, semiconductor device and resin material | Hiroshi Uragami, Osamu Nakagawa, Kinya Fujino, Shinji Takase, Hideki Tokuyama +2 more | 2006-06-06 |
| 6673654 | Method of manufacturing semiconductor device using heated conveyance member | Takao Ohno, Shigeru Kamada, Keisuke Fukuda, Yuzo Shimobeppu | 2004-01-06 |