NM

Naomi Masuda

SL Spansion Llc.: 12 patents #65 of 769Top 9%
Cypress Semiconductor: 4 patents #443 of 1,852Top 25%
NC Nantong Fujitsu Microelectronics Co.: 2 patents #6 of 17Top 40%
Overall (All Time): #239,402 of 4,157,543Top 6%
19
Patents All Time

Issued Patents All Time

Showing 1–19 of 19 patents

Patent #TitleCo-InventorsDate
9437573 Semiconductor device and method for manufacturing thereof Masataka Hoshino, Ryota Fukuyama 2016-09-06
9418940 Structures and methods for stack type semiconductor packaging Masataka Hoshino, Masahiko Harayama, Koji Taya, Masanori Onodera, Ryota Fukuyama 2016-08-16
9385014 Flip-chip package covered with tape 2016-07-05
9362173 Method for chip package Lei Shi, Yujuan Tao, Guohua Gao, Koichi Meguro 2016-06-07
9293441 Semiconductor device and method of manufacturing the same Masataka Hoshino, Junichi Kasai, Kouichi Meguro, Ryota Fukuyama, Yasuhiro Shinma +2 more 2016-03-22
8883627 Method for chip packaging Lei Shi, Guohua Gao, Yujuan Tao, Koichi Meguro 2014-11-11
8796864 Flip chip bonded semiconductor device with shelf Koji Taya 2014-08-05
8765529 Semiconductor device and method for manufacturing the same 2014-07-01
8637986 Semiconductor device and method for manufacturing thereof Masataka Hoshino, Ryota Fukuyama 2014-01-28
8598717 Semiconductor device and method for manufacturing the same 2013-12-03
8486756 Flip chip bonded semiconductor device with shelf and method of manufacturing thereof Koji Taya 2013-07-16
8446015 Semiconductor device and method for manufacturing thereof Kouichi Meguro 2013-05-21
8274158 Structure, method and system for assessing bonding of electrodes in FCB packaging Junichi Kasai, Junji Tanaka 2012-09-25
8030179 Semiconductor device and method of manufacturing the same Masataka Hoshino, Junichi Kasai, Kouichi Meguro, Ryota Fukuyama, Yasuhiro Shinma +2 more 2011-10-04
7892892 Semiconductor device and method for manufacturing thereof Kouichi Meguro 2011-02-22
7846780 Flip-chip package covered with tape 2010-12-07
7816788 Structure, method and system for assessing bonding of electrodes in FCB packaging Junichi Kasai, Junji Tanaka 2010-10-19
7605457 Semiconductor device and method of manufacturing the same Masataka Hoshino, Junichi Kasai, Kouichi Meguro, Ryota Fukuyama, Yasuhiro Shinma +2 more 2009-10-20
5053464 Polyurethane containing metal phthalocyanine in the main chain Hirofusa Shirai, Tatsuya Hongu, Nobuhisa Tsutsumi 1991-10-01