Issued Patents All Time
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10741499 | System-level packaging structures | Lei Shi, Honghui Wang | 2020-08-11 |
| 10515883 | 3D system-level packaging methods and structures | Lei Shi | 2019-12-24 |
| 9595490 | 3D system-level packaging methods and structures | Lei Shi | 2017-03-14 |
| 9548282 | Metal contact for semiconductor device | Chang-Ming Lin, Lei Shi | 2017-01-17 |
| 9543269 | System-level packaging methods and structures | Lei Shi, Honghui Wang | 2017-01-10 |
| 9497862 | Packaging structure | Lei Shi, Guohua Gao, Guoji Yang, Honglei Li, Haijun Shen | 2016-11-15 |
| 9485868 | Package structure | — | 2016-11-01 |
| 9397070 | Method for forming package structure | — | 2016-07-19 |
| 9362173 | Method for chip package | Lei Shi, Guohua Gao, Naomi Masuda, Koichi Meguro | 2016-06-07 |
| 9324583 | Packaging method | Lei Shi, Guohua Gao, Jaingen Shi, Haiqing Zhu | 2016-04-26 |
| 9287205 | Fan-out high-density packaging methods and structures | Lei Shi | 2016-03-15 |
| 9099448 | Three-dimensional system-level packaging methods and structures | Lei Shi, Honghui Wang | 2015-08-04 |
| 9040347 | Fan-out high-density packaging methods and structures | Lei Shi | 2015-05-26 |
| 8883627 | Method for chip packaging | Lei Shi, Guohua Gao, Naomi Masuda, Koichi Meguro | 2014-11-11 |