Issued Patents All Time
Showing 1–16 of 16 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9627289 | Semiconductor device | Yoshihiko Ikemoto, Shigenori Sawachi, Akio Katsumata | 2017-04-18 |
| 7192798 | Fingerprint sensor apparatus and manufacturing method thereof | Akira Okada, Hideharu Sakoda, Michio Hayakawa | 2007-03-20 |
| 7193862 | Ceramic laminated device, communication equipment and method of manufacturing ceramic laminated device | Tomoya Maekawa, Hiroshi Shigemura | 2007-03-20 |
| 6972487 | Multi chip package structure having a plurality of semiconductor chips mounted in the same package | Yoshiharu Kato, Satoru Kawamoto, Tetsuya Hiraoka, Akira Takashima | 2005-12-06 |
| 6812066 | Semiconductor device having an interconnecting post formed on an interposer within a sealing resin | Akira Takashima | 2004-11-02 |
| 6670221 | Semiconductor device having a built-in contact-type sensor and manufacturing method thereof | Hideharu Sakoda | 2003-12-30 |
| 6629462 | Acceleration sensor, an acceleration detection apparatus, and a positioning device | Tetsuro Otsuchi, Takafumi Koike | 2003-10-07 |
| 6489676 | Semiconductor device having an interconnecting post formed on an interposer within a sealing resin | Akira Takashima | 2002-12-03 |
| 6472746 | Semiconductor device having bonding wires serving as external connection terminals | Akira Takashima | 2002-10-29 |
| 6404062 | Semiconductor device and structure and method for mounting the same | Sachiko Nogami, Akira Takashima | 2002-06-11 |
| 6388333 | Semiconductor device having protruding electrodes higher than a sealed portion | Kouhei Orikawa, Tadashi Uno, Fumihiko Ando, Akira Takashima, Hiroshi Onodera +2 more | 2002-05-14 |
| 6344407 | Method of manufacturing solder bumps and solder joints using formic acid | Hirohisa Matsuki, Kunio Kodama, Eiji Watanabe, Masataka Mizukoshi, Hiroyuki Matsui | 2002-02-05 |
| 6291895 | Method of fabricating semiconductor having through hole | Koji Honna, Yoshikazu Kumagaya | 2001-09-18 |
| 6166433 | Resin molded semiconductor device and method of manufacturing semiconductor package | Akira Takashima, Hidehiko Akasaki, Haruo Kojima, Kazunari Kosakai, Koji Honna +1 more | 2000-12-26 |
| 6160313 | Semiconductor device having an insulating substrate | Akira Takashima, Toshihisa Higashiyama | 2000-12-12 |
| 5953592 | Method of fabricating semiconductor having through hole | Koji Honna, Yoshikazu Kumagaya | 1999-09-14 |