Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6166433 | Resin molded semiconductor device and method of manufacturing semiconductor package | Akira Takashima, Hidehiko Akasaki, Haruo Kojima, Fumihiko Taniguchi, Kazunari Kosakai +1 more | 2000-12-26 |
| 6160313 | Semiconductor device having an insulating substrate | Akira Takashima, Fumihiko Taniguchi | 2000-12-12 |