Issued Patents All Time
Showing 1–20 of 20 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11252814 | Grounding structure of high frequency circuit board | Yasuaki ASAHI | 2022-02-15 |
| 8581664 | Pulse electric power amplification apparatus | — | 2013-11-12 |
| 8259686 | Array antenna system and transmit/receive module thereof | Kazuhiro Kanto, Tooru Tanaka | 2012-09-04 |
| 8223080 | Transmission and reception module | — | 2012-07-17 |
| 7781259 | Method of manufacturing a semiconductor using a rigid substrate | Youhei Nagahama, Katsunori Wako, Yuichi Asano, Masanori Takahashi, Masamichi Fujimoto +2 more | 2010-08-24 |
| 7436353 | Transmitting-receiving module of radar system | — | 2008-10-14 |
| 7423491 | Semiconductor amplifier | — | 2008-09-09 |
| 7372315 | Switching circuit using semiconductor switching element | — | 2008-05-13 |
| 7262668 | Semiconductor amplifier | — | 2007-08-28 |
| 7122402 | Method of manufacturing a semiconductor device using a rigid substrate including the vent-end edge portion of the substrate has a thickness smaller than the other portions of the substrate | Youhei Nagahama, Katsunori Wako, Yuichi Asano, Masanori Takahashi, Masamichi Fujimoto +2 more | 2006-10-17 |
| 7123089 | Power amplifier with pulse differentiating circuit | — | 2006-10-17 |
| 7009462 | Limiter circuit | — | 2006-03-07 |
| 6762493 | Microwave integrated circuit | Tomoyuki Kitani | 2004-07-13 |
| 6383397 | Method for separating magnetic particles mixed in fluid, separating system, and separator | — | 2002-05-07 |
| 6166433 | Resin molded semiconductor device and method of manufacturing semiconductor package | Akira Takashima, Hidehiko Akasaki, Fumihiko Taniguchi, Kazunari Kosakai, Koji Honna +1 more | 2000-12-26 |
| 6138833 | Placer gold mining method, placer gold mining boat used in this method, placer gold digging and separating method and system therefor, and placer gold separating method and system therefor | Tamisuke Matsufuji | 2000-10-31 |
| 6023080 | Input/output connection structure of a semiconductor device | — | 2000-02-08 |
| 5244512 | Method for treating metal surface with zinc phosphate | Isao Kawasaki, Minoru Ishida, Asao Mochizuki | 1993-09-14 |
| 4710250 | Method for producing a package for a semiconductor device | Hidehiko Akasaki | 1987-12-01 |
| 4278865 | Gas shielded stud welding method | Hiroyuki Watanabe, Eiji Miyoshi, Takeshi Yoshida, Masaaki Kato, Shizuo Miyazaki | 1981-07-14 |