Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6291895 | Method of fabricating semiconductor having through hole | Fumihiko Taniguchi, Yoshikazu Kumagaya | 2001-09-18 |
| 6166433 | Resin molded semiconductor device and method of manufacturing semiconductor package | Akira Takashima, Hidehiko Akasaki, Haruo Kojima, Fumihiko Taniguchi, Kazunari Kosakai +1 more | 2000-12-26 |
| 5953592 | Method of fabricating semiconductor having through hole | Fumihiko Taniguchi, Yoshikazu Kumagaya | 1999-09-14 |