Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6166433 | Resin molded semiconductor device and method of manufacturing semiconductor package | Akira Takashima, Haruo Kojima, Fumihiko Taniguchi, Kazunari Kosakai, Koji Honna +1 more | 2000-12-26 |
| 6063640 | Semiconductor wafer testing method with probe pin contact | Masataka Mizukoshi, Masao Nakano, Yasuhiro Fujii, Shinnosuke Kamata, Makoto Yanagisawa +4 more | 2000-05-16 |
| 5861670 | Semiconductor device package | — | 1999-01-19 |
| 4737884 | Semiconductor device module | Kensaku Wada | 1988-04-12 |
| 4710250 | Method for producing a package for a semiconductor device | Haruo Kojima | 1987-12-01 |
| 4689658 | Modular semiconductor device | Kiyoshi Miyasaka | 1987-08-25 |
| 4682207 | Semiconductor device including leadless packages and a base plate for mounting the leadless packages | Takehisa Tsujimura | 1987-07-21 |
| 4539622 | Hybrid integrated circuit device | — | 1985-09-03 |
| D276719 | Integrated circuit device | Masahiro Sugimoto, Tetsushi Wakabayashi | 1984-12-11 |
| 4458291 | Package for enclosing semiconductor elements | Mamoru Yanagisawa, Hideji Aoki | 1984-07-03 |