Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6281571 | Semiconductor device having an external connection electrode extending through a through hole formed in a substrate | Akira Takashima, Fumihiko Ando, Mitsuru Sato, Takashi Suzuki, Yoshikazu Kumagaya | 2001-08-28 |
| 6166433 | Resin molded semiconductor device and method of manufacturing semiconductor package | Akira Takashima, Hidehiko Akasaki, Haruo Kojima, Fumihiko Taniguchi, Koji Honna +1 more | 2000-12-26 |