HA

Hideji Aoki

Mitsubishi Electric: 8 patents #3,714 of 25,717Top 15%
Fujitsu Limited: 4 patents #7,093 of 24,456Top 30%
ML Mitsubishi Electric Engineering Company, Limited: 4 patents #34 of 352Top 10%
Overall (All Time): #389,215 of 4,157,543Top 10%
13
Patents All Time

Issued Patents All Time

Showing 1–13 of 13 patents

Patent #TitleCo-InventorsDate
6530764 Mold for resin-sealing of semiconductor devices Yoshiyuki Mishima, Tetsuya Hirose, Hiromichi Yamada, Toru Ueno, Kiyoharu Kato 2003-03-11
6363976 Semiconductor manufacturing apparatus and method of manufacturing semiconductor device Hidekazu Manabe, Katsuhito Kamachi 2002-04-02
6337042 Press machine and method of manufacturing pressed products Suekazu Nakashima, Yasuo Kawano 2002-01-08
6242287 Semiconductor device manufacturing method, press die and guide rail including forming a crack perpendicular to an extension of the sealing resin Hidenori Sekiya, Kenichirou Katou, Hiromu Nishitani 2001-06-05
5842257 Apparatus for and method of fabricating semiconductor devices Takahiro Tashima 1998-12-01
5636127 Method and apparatus for carrying and locating sheet frame Hidetaka Yamasaki, Kazuhisa Hiroshige 1997-06-03
5587633 Press control method and press apparatus Takahiro Tashima, Suekazu Nakashima, Yoshiyuki Osako, Hidetaka Yamasaki 1996-12-24
5520276 Method and apparatus for carrying and locating sheet frame Hidetaka Yamasaki, Kazuhisa Hiroshige 1996-05-28
5177992 Device for feeding thin-web frame Toshinobu Banjo 1993-01-12
4626960 Semiconductor device having soldered bond between base and cap thereof Toshio Hamano, Kaoru Tachibana 1986-12-02
4590672 Package for electronic device and method for producing same Shokichi Shimizu, Susumu Kida, Yuki KANAZAWA 1986-05-27
4558346 Highly reliable hermetically sealed package for a semiconductor device Susumu Kida, Hayato USAMI 1985-12-10
4458291 Package for enclosing semiconductor elements Mamoru Yanagisawa, Hidehiko Akasaki 1984-07-03