Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7077170 | Method of forming leads of a semiconductor device | Hidetaka Yamasaki, Itaru Matsuo, Hidekazu Manabe, Kenji Imamura, Mitsutaka Matsuo | 2006-07-18 |
| 6242287 | Semiconductor device manufacturing method, press die and guide rail including forming a crack perpendicular to an extension of the sealing resin | Hideji Aoki, Hidenori Sekiya, Hiromu Nishitani | 2001-06-05 |