HM

Hidekazu Manabe

RT Renesas Technology: 2 patents #1,374 of 3,337Top 45%
FL Fujitsu Ten Limited: 1 patents #456 of 996Top 50%
Mitsubishi Electric: 1 patents #15,491 of 25,717Top 65%
ML Mitsubishi Electric Engineering Company, Limited: 1 patents #138 of 352Top 40%
RD Renesas Device Design: 1 patents #9 of 22Top 45%
TO Toyota: 1 patents #15,335 of 26,838Top 60%
Overall (All Time): #1,032,072 of 4,157,543Top 25%
5
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
7185425 Method for connecting printed circuit boards Takashi Ohta, Kazuaki Yamada, Kiyoshi Tsujii 2007-03-06
7077170 Method of forming leads of a semiconductor device Hidetaka Yamasaki, Itaru Matsuo, Kenji Imamura, Kenichirou Katou, Mitsutaka Matsuo 2006-07-18
6925922 Apparatus for removing tiebars after molding of semiconductor chip Kenta Matsunaga 2005-08-09
6363976 Semiconductor manufacturing apparatus and method of manufacturing semiconductor device Hideji Aoki, Katsuhito Kamachi 2002-04-02
5950687 Lead forming apparatus and lead forming method Kaoru Ishihara 1999-09-14