KM

Kenta Matsunaga

Canon: 8 patents #7,260 of 19,416Top 40%
RT Renesas Technology: 1 patents #1,991 of 3,337Top 60%
📍 Susono, JP: #351 of 1,238 inventorsTop 30%
Overall (All Time): #558,653 of 4,157,543Top 15%
9
Patents All Time

Issued Patents All Time

Showing 1–9 of 9 patents

Patent #TitleCo-InventorsDate
10976683 Electrophotographic member, electrophotographic process cartridge, and electrophotographic image forming apparatus Kazutoshi Ishida, Yuji Sakurai, Minoru Nakamura, Ryo Sugiyama, Toru Ishii 2021-04-13
10942471 Electrophotographic member having a surface layer with a cross-linked urethane resin-containing matrix, process cartridge, and apparatus Yoshinobu Ogawa, Ryo Sugiyama, Kazuaki Nagaoka, Toru Ishii, Hideya Arimura +4 more 2021-03-09
10895824 Developing roller, process cartridge and electrophotographic image forming apparatus Ryo Sugiyama, Yoshinobu Ogawa, Masashi Uno, Tomoya Uesugi, Wataru Moriai 2021-01-19
10895823 Developing roller, process cartridge and electrophotographic image forming apparatus Masashi Uno, Ryo Sugiyama, Kazuaki Nagaoka 2021-01-19
10831126 Developing roller having crown-shaped electro-conductive layer with outer surface providing electrically insulating first regions adjacent to second regions having higher conductivity Minoru Nakamura, Kazuaki Nagaoka, Ryo Sugiyama, Masashi Uno, Fumihiko Utsuno 2020-11-10
10642186 Developing member having outer surface with independent electrically insulating domains, electrophotographic process cartridge, and electrophotographic image forming apparatus Yuji Sakurai, Minoru Nakamura, Ryo Sugiyama, Kazutoshi Ishida, Hiroshi Morishita +1 more 2020-05-05
10310447 Electrophotographic member, process cartridge, and electrophotographic image forming apparatus Hiroshi Morishita, Yuji Sakurai, Kazutoshi Ishida, Minoru Nakamura, Toru Ishii +1 more 2019-06-04
9952531 Developing member having alumina particles exposed within protrusions Toru Ishii, Minoru Nakamura, Hiroshi Morishita 2018-04-24
6925922 Apparatus for removing tiebars after molding of semiconductor chip Hidekazu Manabe 2005-08-09