Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7207868 | Cutting apparatus | Masataka Takehara, Masaharu Yoshida, Yasuyuki Kitagawa, Kazuyuki Kishimoto | 2007-04-24 |
| 6530764 | Mold for resin-sealing of semiconductor devices | Yoshiyuki Mishima, Tetsuya Hirose, Hideji Aoki, Hiromichi Yamada, Toru Ueno | 2003-03-11 |