Issued Patents All Time
Showing 1–17 of 17 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8552542 | Lead frame, semiconductor device, method of manufacturing lead frame, and method of manufacturing semiconductor device | — | 2013-10-08 |
| 7556985 | Method of fabricating semiconductor device | Norio Fukasawa, Hirohisa Matsuki, Kenichi Nagashige, Yuzo Hamanaka | 2009-07-07 |
| 7064047 | Semiconductor device having a ball grid array and a fabrication process thereof | Norio Fukasawa, Hirohisa Matsuki, Kenichi Nagashige, Yuzo Hamanaka | 2006-06-20 |
| 6987054 | Method of fabricating a semiconductor device having a groove formed in a resin layer | Norio Fukasawa, Hirohisa Matsuki, Kenichi Nagashige, Yuzo Hamanaka | 2006-01-17 |
| 6881611 | Method and mold for manufacturing semiconductor device, semiconductor device and method for mounting the device | Norio Fukasawa, Toshimi Kawahara, Mitsunada Osawa, Yasuhiro Shinma, Hirohisa Matsuki +6 more | 2005-04-19 |
| 6875638 | Manufacturing method of a semiconductor device incorporating a passive element and a redistribution board | Yoshiyuki Yoneda, Masaharu Minamizawa, Nobutaka Shimizu, Kazuyuki Imamura, Atsushi Kikuchi +6 more | 2005-04-05 |
| 6784542 | Semiconductor device having a ball grid array and a fabrication process thereof | Norio Fukasawa, Hirohisa Matsuki, Kenichi Nagashige, Yuzo Hamanaka | 2004-08-31 |
| 6700198 | Resin for semiconductor wire | Hideki Toya, Mitsuyoshi Imai, Masaki Sakaguchi, Naoki Yamabe, Mamoru Suwa +2 more | 2004-03-02 |
| 6693029 | Method of forming an insulative substrate having conductive filled vias | Makoto Iijima, Masaru Nukiwa, Seiji Ueno | 2004-02-17 |
| 6657282 | Semiconductor device having a ball grid array and a fabrication process thereof | Norio Fukasawa, Hirohisa Matsuki, Kenichi Nagashige, Yuzo Hamanaka | 2003-12-02 |
| 6573600 | Multilayer wiring substrate having differential signal wires and a general signal wire in different planes | Atsushi Kikuchi, Makoto Iijima, Yoshihiko Ikemoto, Yoshiyuki Kimura | 2003-06-03 |
| 6471501 | Mold for fabricating semiconductor devices | Yasuhiro Shinma, Norio Fukasawa, Yuzo Hamanaka, Tadashi Uno, Hirohisa Matsuki +1 more | 2002-10-29 |
| 6455920 | Semiconductor device having a ball grid array and a fabrication process thereof | Norio Fukasawa, Hirohisa Matsuki, Kenichi Nagashige, Yuzo Hamanaka | 2002-09-24 |
| 6396155 | Semiconductor device and method of producing the same | Masaru Nukiwa, Makoto Iijima, Seiji Ueno | 2002-05-28 |
| 6351031 | Semiconductor device and method for manufacturing substrate of the same | Makoto Iijima, Masaru Nukiwa, Seiji Ueno | 2002-02-26 |
| 6348416 | Carrier substrate for producing semiconductor device | Hideki Toya, Mitsuyoshi Imai, Masaki Sakaguchi, Naoki Yamabe, Mamoru Suwa +2 more | 2002-02-19 |
| 6339261 | Semiconductor device and process of producing same | Masahiro Yonemochi, Toshiyuki Motooka, Hideharu Sakoda, Mamoru Suwa | 2002-01-15 |