Issued Patents All Time
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10320260 | Canned motor and vacuum pump | Naoya Yoshida, Yoshinori Ojima, Takanori Inada, Toshiharu Nakazawa, Atsushi Oyama | 2019-06-11 |
| 9660496 | Canned motor and vacuum pump | Naoya Yoshida, Yoshinori Ojima, Takanori Inada, Toshiharu Nakazawa, Atsushi Oyama | 2017-05-23 |
| 9614411 | Canned motor and vacuum pump | Naoya Yoshida, Yoshinori Ojima, Takanori Inada, Toshiharu Nakazawa, Atsushi Oyama | 2017-04-04 |
| 9429166 | Sealing structure, vacuum pump motor including same sealing structure, and vacuum pump | Takanori Inada, Naoya Yoshida, Yoshinori Ojima, Toshiharu Nakazawa | 2016-08-30 |
| 9291155 | Vacuum pump motor and vacuum pump having balance rings | Yoshinori Ojima, Naoya Yoshida, Takanori Inada, Toshiharu Nakazawa | 2016-03-22 |
| 8251678 | Vacuum pump unit | Nobuhito Miyashita, Takanori Inada, Kozo Matake, Yoshinori Ojima, Susumu Miyake +1 more | 2012-08-28 |
| D629422 | Pump mount base for vacuum compression apparatus | Kensuke Fujita | 2010-12-21 |
| 6541848 | Semiconductor device including stud bumps as external connection terminals | Toshimi Kawahara, Mamoru Suwa, Masanori Onodera, Syuichi Monma, Shinya Nakaseko | 2003-04-01 |
| 6515347 | Wafer level semiconductor device and method of manufacturing the same | Yasuhiro Shinma, Norio Fukasawa, Toshimi Kawashara, Masamitsu Ikumo | 2003-02-04 |
| 6511620 | Method of producing semiconductor devices having easy separability from a metal mold after molding | Toshimi Kawahara, Hirohisa Matsuki, Yasuhiro Shinma, Yoshiyuki Yoneda, Norio Fukasawa +2 more | 2003-01-28 |
| 6507092 | Semiconductor device having increased reliability and method of producing the same and semiconductor chip suitable for such a semiconductor device and method of producing the same | Norio Fukasawa, Toshimi Kawahara | 2003-01-14 |
| 6469370 | Semiconductor device and method of production of the semiconductor device | Toshimi Kawahara, Hirohisa Matsuki, Yasuhiro Shinma, Yoshiyuki Yoneda, Norio Fukasawa +2 more | 2002-10-22 |
| 6329711 | Semiconductor device and mounting structure | Toshimi Kawahara, Mamoru Suwa, Masanori Onodera, Syuichi Monma, Shinya Nakaseko +2 more | 2001-12-11 |
| 5844309 | Adhesive composition, semiconductor device using the composition and method for producing a semiconductor device using the composition | Yukio Takigawa, Shigeaki Yagi, Toshimi Kawahara, Mitsunada Osawa, Hiroyuki Ishiguro +2 more | 1998-12-01 |