Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6541848 | Semiconductor device including stud bumps as external connection terminals | Toshimi Kawahara, Mamoru Suwa, Masanori Onodera, Syuichi Monma, Takashi Hozumi | 2003-04-01 |
| 6329711 | Semiconductor device and mounting structure | Toshimi Kawahara, Mamoru Suwa, Masanori Onodera, Syuichi Monma, Takashi Hozumi +2 more | 2001-12-11 |
| 6034428 | Semiconductor integrated circuit device having stacked wiring and insulating layers | Toshimi Kawahara, Hiroyuki Ishiguro, Mitsunada Osawa, Shinichirou Taniguchi, Mayumi Osumi +2 more | 2000-03-07 |
| 5844309 | Adhesive composition, semiconductor device using the composition and method for producing a semiconductor device using the composition | Yukio Takigawa, Shigeaki Yagi, Toshimi Kawahara, Mitsunada Osawa, Hiroyuki Ishiguro +2 more | 1998-12-01 |
| 5804467 | Semiconductor device and method of producing the same | Toshimi Kawahara, Mitsunada Osawa, Shinichirou Taniguchi, Mayumi Osumi, Hiroyuki Ishiguro +2 more | 1998-09-08 |
| 5679978 | Semiconductor device having resin gate hole through substrate for resin encapsulation | Toshimi Kawahara, Mitsunada Osawa, Shinichirou Taniguchi, Mayumi Osumi, Hiroyuki Ishiguro +2 more | 1997-10-21 |