Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6383842 | Method for producing semiconductor device having increased adhesion between package and semiconductor chip bottom | Akira Takashima, Mitsutaka Sato | 2002-05-07 |
| 6379997 | Semiconductor device and method of producing the same and semiconductor device unit and method of producing the same | Toshimi Kawahara, Sinya Nakaseko, Mitsunada Osawa, Mayumi Osumi, Hiroyuki Ishiquro +3 more | 2002-04-30 |
| 6111306 | Semiconductor device and method of producing the same and semiconductor device unit and method of producing the same | Toshimi Kawahara, Sinya Nakaseko, Mitsunada Osawa, Mayumi Osumi, Hiroyuki Ishiguro +3 more | 2000-08-29 |
| 6034428 | Semiconductor integrated circuit device having stacked wiring and insulating layers | Toshimi Kawahara, Hiroyuki Ishiguro, Mitsunada Osawa, Mayumi Osumi, Shinya Nakaseko +2 more | 2000-03-07 |
| 5821613 | Semiconductor device in which semiconductor chip has bottom surface with reduced level of organic compounds relatively to other sufaces thereof | Akira Takashima, Mitsutaka Sato | 1998-10-13 |
| 5804467 | Semiconductor device and method of producing the same | Toshimi Kawahara, Shinya Nakaseko, Mitsunada Osawa, Mayumi Osumi, Hiroyuki Ishiguro +2 more | 1998-09-08 |
| 5679978 | Semiconductor device having resin gate hole through substrate for resin encapsulation | Toshimi Kawahara, Shinya Nakaseko, Mitsunada Osawa, Mayumi Osumi, Hiroyuki Ishiguro +2 more | 1997-10-21 |