YT

Yukio Takigawa

Fujitsu Limited: 13 patents #2,362 of 24,456Top 10%
KT Kabushiki Kaisha Toshiba: 3 patents #8,011 of 21,451Top 40%
FL Fujitsu Semiconductor Limited: 1 patents #612 of 1,301Top 50%
SC Sumitomo Bakelite Co.: 1 patents #403 of 790Top 55%
TL Tokyo Electron Limited: 1 patents #3,538 of 5,567Top 65%
TO Toshiba: 1 patents #1,121 of 2,688Top 45%
AD Advantest: 1 patents #714 of 1,193Top 60%
TI Toray Industries: 1 patents #2,000 of 3,690Top 55%
EB Ebara: 1 patents #1,014 of 1,611Top 65%
Overall (All Time): #257,708 of 4,157,543Top 7%
18
Patents All Time

Issued Patents All Time

Showing 1–18 of 18 patents

Patent #TitleCo-InventorsDate
8675808 Natural circulation type boiling water reactor Nobuaki Abe, Yutaka Takeuchi, Mikihide Nakamaru 2014-03-18
7811936 Method of producing semiconductor device 2010-10-12
7709394 Substrate processing method and apparatus fabrication process of a semiconductor device Hidenori Miyoshi, Kenji Ishikawa, Yoshihiro Nakata, Hideki Tateishi 2010-05-04
7481264 Steam condenser Shoji Nakajima, Shunichi Goshima, Fumio Obara, Akira Nemoto, Shunji Kawano +2 more 2009-01-27
7390741 Method for fabricating semiconductor device Tamotsu Yamamoto, Yoshiyuki Okura, Takahiro Kono, Tsutomu Hosoda 2008-06-24
7211519 Method for manufacturing semiconductor device Noriyoshi Shimizu, Toshiya Suzuki, Hajime Kawabe 2007-05-01
6943115 Semiconductor device and method of manufacture thereof Hiroshi Horiuchi, Tamotsu Yamamoto, Shigeru Suzuki, Nobuaki Santo, Motoshu Miyajima 2005-09-13
6693046 Method of manufacturing semiconductor device having multilevel wiring Shun-ichi Fukuyama 2004-02-17
6656996 Semiconductor-sealing resin composition and semiconductor device using it Yasuaki Tsutsumi, Tetsuya Mieda, Masayuki Tanaka, Toshimi Kawahara 2003-12-02
6565419 Method of removing particles from stage and cleaning plate Naoki Nishio, Kazushi Ishida, Ei Yano 2003-05-20
6361879 Semiconductor device and method for fabricating it, and semiconductor sealing resin composition Yasuaki Tsutsumi, Masayuki Tanaka, Toshimi Kawahara 2002-03-26
6338903 Resin composition for semiconductor encapsulation, method and apparatus for producing the composition, as well as semiconductor device using the composition Ei Yano 2002-01-15
6278192 Semiconductor device with encapsulating material composed of silica Ei Yano 2001-08-21
5844309 Adhesive composition, semiconductor device using the composition and method for producing a semiconductor device using the composition Shigeaki Yagi, Toshimi Kawahara, Mitsunada Osawa, Hiroyuki Ishiguro, Shinya Nakaseko +2 more 1998-12-01
5763540 Epoxy resin composition for encapsulating semiconductor Yoshihiro Nakata, Shigeaki Yagi, Norio Sawatari 1998-06-09
5659004 Epoxy resin composition Yoshihiro Nakata, Shigeaki Yagi, Norio Sawatari, Nobuo Kamehara 1997-08-19
5406598 System for monitoring power of nuclear reactor Yutaka Takeuchi, Hitoshi Uematsu 1995-04-11
4319959 Method of supervising the channel stability in reactor cores of nuclear reactors Kazuo Monta 1982-03-16